Fabrication of Microfluidic Chip Mold Based on Electrochemical Etching and Micro-Electroforming
Liqun DU,Qingfeng LI,Yuanqi LI,Wenjun ZHAO
DOI: https://doi.org/10.16080/j.issn1671-833x.2017.17.016
2017-01-01
Abstract:The performance of microfluidic chip mold is subject to the adhesion strength between electroform-ing layer and substrate in micro-electroforming process. In order to remedy this defect, a novel, lithograph-based method combining through-mask electrochemical etching and micro-electroforming is presented, by which the nickel double cross microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process parameters, not only optimal parameters were yielded, but also issues like the failure of interfacial delamination due to pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etch-ing on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing strength after pickling (25℃, 20s) and etching(30℃, 5min) is increased by 98.5％ and 203.6％ respectively, compared with that of untreated samples. Furthermore, the shearing strength of samples etched is 53.0％ higher than that of samples after pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electro-forming layer and the substrate. Additionally, the service life of microfluidic chip mold can be prolonged.The performance of microfluidic chip mold is subject to the adhesion strength between electroform-ing layer and substrate in micro-electroforming process. In order to remedy this defect, a novel, lithograph-based method combining through-mask electrochemical etching and micro-electroforming is presented, by which the nickel double cross microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process parameters, not only optimal parameters were yielded, but also issues like the failure of interfacial delamination due to pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etch-ing on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing strength after pickling (25℃, 20s) and etching(30℃, 5min) is increased by 98.5％ and 203.6％ respectively, compared with that of untreated samples. Furthermore, the shearing strength of samples etched is 53.0％ higher than that of samples after pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electro-forming layer and the substrate. Additionally, the service life of microfluidic chip mold can be prolonged.