Process Simulation Based on Anodic Bonding Models
Chen Weiping,Zhang Dan,Liu Xiaowei,Chuai Rongyan
DOI: https://doi.org/10.3321/j.issn:1004-132X.2005.z1.094
2005-01-01
Abstract:Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.
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