The process in study of organosilicone sealants with low modulus and high elongation

Xin-jie LIU,Hong-Guo HU,Chun-Rong CHEN,Wei-Wei LIN,Qiang ZHENG
DOI: https://doi.org/10.3321/j.issn:1001-9731.2005.03.003
2005-01-01
Abstract:The organosilicone sealants with low modulus, high elongation have become increasingly important due to its desirable properties for modern construction technology. In present paper, several optional approaches including fillers treatment, plasticizer selection, chain-extending and cross-linking control, which can all be utilized to obtain low modulus, high elongation organosilicone sealants, were reviewed with 24 references. The forthcoming developments and concerns were proposed.
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