Abstract:SU-8 photoresist can be used to produce high aspect ratio and three-dimensional (3D) lithographic patterning based on standard contact lithography equipment due to its excellent coating, planarization, and processing properties and thus has become the favorite photoresist material for the fabrication of various microelectromechanical system (MEMS) structures and devices. However, as feature sizes get smaller and pattern complexity increases, particular difficulties arise and need to be carefully considered. The accuracy and precision, with which a feature on a mask can be reproduced throughout a thick resist structure, will depend on key parameters in the setup, the material properties of the SU-8 resist, and the thickness of the resist structure. Modeling and simulation studies may help improve our understanding and process design of the SU-8 lithography, thereby allowing rapid product and process development. In this chapter, the basic process and mechanism of UV lithography of the SU-8 are introduced briefly. Various models for the lithography, including the aerial image model, exposure model, postexposure bake model, and development model, are presented and discussed. Main algorithms for the etching surface advancement simulation, including the string, ray-tracing, cellular automaton, and fast-marching algorithms, are then compared and analyzed. Simulations of the UV lithography of the SU-8 are presented, and a series of experiments have been performed for SU8 2000 series photoresists under UV source with 365 nm (2.6 mW/cm2) radiation. The simulation results demonstrate to be in agreement with the experimental results. This is useful to optimize the inclined UV lithography processes of SU8 photoresists and to accurately design and control the dimensions of some MEMS microstructures. Z.-F. Zhou (*) • Q.-A. Huang Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China e-mail: zfzhou@seu.edu.cn; hqa@seu.edu.cn # Springer Nature Singapore Pte Ltd. 2017 Q.-A. Huang (ed.), Micro Electro Mechanical Systems, Micro/Nano Technologies, https://doi.org/10.1007/978-981-10-2798-7_3-1 1

THE PROPERTIES,APPLICATION PROCESSING AND PROSPECT OF EPOXY-BASED NEGATIVE PHOTORESIST SU-8

Characterization of the polymerization of SU-8 photoresist and its applications in micro-electro-mechanical systems (MEMS)

Experimental Research on Adhesive Characteristics Between SU - 8 Resist and Substrate

Process Research of High Aspect Ratio Microstructure Using SU-8 Resist

A New Fabrication Process for Uniform SU-8 Thick Photoresist Structures by Simultaneously Removing Edge Bead and Air Bubbles

Optical properties and process of the diluted SU8 resist

Orthogonal Method For Processing Of Su-8 Resist In Uv-Liga

Fabrication of Su-8 Moulds on Glass Substrates by Using A Common Thin Negative Photoresist As an Adhesive Layer

Thick SU8 Microstructures Prepared by Broadband UV Lithography and the Applications in MEMS Devices

Applications Of Nanoimprint Lithography For Biochemical And Nanophotonic Structures Using Su-8

Development of Novel SU-8 Based Nanoimprint Lithography

Enhancement of Mechanical and Thermal Properties of SU-8 Photoresist with Multilayer Woven Glass Fabric Based on Micromachining Technology

Modeling and Simulation of SU-8 Thick Photoresist Lithography

Two-photon Polymerization Fabrication and Raman Spectroscopy Research of SU-8 Photoresist Using the Femtosecond Laser

Nonchemically Amplified Molecular Resists Based on Sulfonium-Functionalized Sulfone Derivatives for Sub-13 nm Nanolithography

Comprehensive Simulations For Ultraviolet Lithography Process Of Thick Su-8 Photoresist

Study on Deep Reactive Ion Etching of SU-8 Photoresist

THE STUDY ON THE O<sub>2</sub> PLASMA TREATMENT FOR BONDING OF SU-8 LAYERS

Simulation of SU-8 Photoresist Profile in Deep UV Lithography

Application of ultrasonic stress relief in the fabrication of SU-8 micro structure

Recent Advances in Positive Photoresists: Mechanisms and Fabrication