Abstract:The vibration liquid phase diffusion bonding of SiCp/A356 composite in air has been investigated. The surface of specimens to be bonded was treated with and without vibration under the bonding condition. It was found by atomic force microscopy analysis that some of the oxide film could be broken down when ridges on the surface of the matrix were ground down. Dissolution of the base metal by the filler metal occurred with removal of the oxide film during vibration liquid phase bonding, and SiC particles in the base metal entered the bond region. A removal process model for vibration bonding has been established with and without filler metal. Results show that shearing and impacting actions are the two main breaking mechanisms during vibration; the oxide film bulk is generally broken down by shear, and dissolution of the base metal by the filler metal promotes particle segregation from the matrix and their entry into the bond region.

Modelling Behaviour of Oxide Film During Vibration Diffusion Bonding of SiCp/A356 Composite in Air