Abstract:The locations of ROM, RAM, and CPU often were required to fix a priori while other modules are subject to be placed in the rest of the chip area. These situations were formulated as placement with pre-placed modules. Rectilinear substrate and holes of the substrate can be also modeled with the use of pre-placed modules. Unlike the coding scheme based stochastic optimization placement algorithms, which need special feasible checking of the representation for placement with pre-placed modules, we develop a new deterministic algorithm to cope with the same problem. The placement area is evaluated first. Then the flexibility of each placement module is calculated according to its packing location, size and connectivity among other neighbor modules. According to the less flexibility first principle, the placement is completed through a recursive packing process. Pre-placed modules just form the placement area, no extra calculation is needed. Experiment results show our algorithm is better than stochastic algorithm

Interconnection Driven VLSI Module Placement Based on Quadratic Programming and Considering Congestion Using LFF Principles

Interconnection driven placement algorithm based on LFF principle

Module Placement Based On Quadratic Programming And Rectangle Packing Using Less Flexibility First Principle

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Deterministic VLSI block placement algorithm using Less Flexibility First principle

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VLSI Module Placement with Pre-Placed Modules and Considering Congestion Using Solution Space Smoothing.

Module Placement On Arbitrarily Rectilinear Regions Using Less Flexibility First Principles

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SOLUTION SPACE SMOOTHING FOR VLSI MODULE PLACEMENT: A COMPUTATIONAL STUDY

A Multilevel Analytical Placement for 3D ICs

Combining clustering and partitioning in quadratic placement

A New Approach Based on Lff for Optimization of Dynamic Hardware Reconfigurations