Abstract:The expansion of the IC dimension is ushering in a more-than-Moore era, necessitating corresponding EDA tools. Existing TSV-based 3D placers focus on minimizing cuts, while burgeoning F2F-bonded ICs features dense interconnection between two planar die. Towards this novel structure, we proposed an integrated adaptation methodology upon mature one-die-based placement strategies. First, we instructively utilized a one-die placer to provide a statistical looking-ahead net diagnosis. The netlist henceforth shall be coarsened topologically and geometrically with a multi-level framework. Level by level, the partition will be refined according to a multi-objective gain formulation, including cut expectation, heterogeneous row height, and balanced cell distribution. Given the partition, we synchronized the behavior of analytical planar placers by balancing the density and wirelength objective function among asymmetric layers. Finally, the result will be further improved by heuristic bonding terminals’ detail placement and a post-place partition adjustment. Compared to the top three winners of the 2022 CAD Contest at ICCAD, experiment results show that our fine-grained fusion upon partitioning and placement gets the best normalized average wirelength with a fairly reasonable runtime under all 3D architectural constraints.

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O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs