Residual stress tuned magnetic properties of thick CoMnP/Cu multilayers
Yu-Shan Chen,Chiao-Chi Lin,Tsung-Shune Chin,Jen-Yuan Chang,Cheng-Kuo Sung,Jen-Yuan (James) Chang
DOI: https://doi.org/10.1063/9.0000319
IF: 1.697
2022-03-01
AIP Advances
Abstract:Electrodeposited hard magnetic thick films have vast applications in the microelectromechanical systems (MEMS). Yet the very large residual stresses (σ r ) built-up in monolayered thick magnetic films leads to cracks, dimensional changes and deteriorated magnetic properties. Here, we explored quantitatively magnetic properties of CoMnP/Cu multilayers tuned by σ r , which in turn are varied by the inserted soft Cu interlayer and thickness of single CoMnP magnetic layers. The configuration of the multilayers is an alternating CoMnP/Cu on Cu-substrate. The thickness of Cu interlayer was 1.4 μm. We kept a sum of all magnetic layers in the multilayers at ∼20 μm to benchmark with a 19.4 μm monolayered CoMnP. The magnetic layers are 94 wt.% Co and possess highly textured (002) hexagonal close packed microstructures. We characterized the apparent crystallite stresses through sin 2 ψ method by X-ray diffractometer (XRD) and residual film stress by curvature method. The insertion of Cu interlayers effectively reduces σ r by 23% through stacking with six single-layered CoMnP. The out-of-plane (OP) anisotropy is slightly reduced. While the maximum energy product in the in-plane (IP) direction can be significantly enhanced by 430% ∼ 690% with increasing the number of the CoMnP single layer in the multilayers. The magneto-elastic behaviors well explain the evolution of the total anisotropy energy of the mono- and multi-layers. By CoMnP/Cu configurations we successfully worked out a strategy to preserve prestigious OP performance while to enhance IP properties by 4 to 6 times to meet ever increasing challenges in MEMS applications.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology