Abstract:Soldering is the default joining process in the electronic packaging industry. Solder joints are obtained by interaction of the substrate with the molten solder. Soldering reaction and the resulting dissolution of substrate material is a complicated process. Reliability and strength of solder joints during service have always been the critical issues in electronic packaging industry. Mechanical strength of solder joints can significantly be increased by employing composite solders. These composite solders are sometimes obtained by incorporation of micro- and nano-size metal particles in the solder paste before the soldering process. Better understanding of substrate-solder interaction is important for the proper selection of the reinforcing particle size and composition. In the present research the relative importance of interface reaction and diffusion has been studied. Dissolution kinetics of a planar substrate and spherical particles has been investigated. Our results show that the dissolution is governed both by interface kinetics and long-range diffusion. Non-equilibrium behavior has been observed in the early stage of the process. It has been observed that at the early stage the dissolution process is governed by interface kinetics, while diffusion became the rate controlling mechanism at the later phase. A mathematically rigorous model has been proposed for simulating the dissolution of the substrate in the liquid lead-free solders. The study is extended to investigate the dissolution of spherical particles in molten solders. The results show that the initial particle dimension plays a critical role in the end particle size after the reflow process.

Break-Up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

A Study of Laser Jet Soldering Process with 55 Μm Tin Balls for Head Gimbal Assembly Manufacturing

Nickel solder ball performance for Pb-free LFBGA assembly under oxygenous reflow

Design of Uniform Solder Droplets Jet System

Effects of size and cooling rate on solidification behavior of freestanding Sn-3.0Ag-0.5Cu solder balls

Controllable fabrication of Sn–Bi alloy microspheres for improved lead-free solder

Reflow of Lead-Free Solder by Microwave Heating

Non-Equilibrium Dissolution Kinetics of Micro-Size Metal Particles in Lead-Free Solders

A Novel Ultrasonic Atomization Process For Producing Spherical Metal Powder

Microstructure Evolution, Interfacial Reaction and Mechanical Properties of Lead-Free Solder Bump Prepared by Induction Heating Method

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Dynamic Wetting Behavior and Solder Ball Spattering Formation of Sn-Bi Solder Pastes During Reflow Soldering Process

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Oxygenous reflow affecting performance of Pb-free TFBGA assembly

Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58bi/Cu Solder Interconnect During Reflow Soldering Process

Solder Stability for Pb-free HBGA Assembly with Oxygenous Reflow

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Study on properties of lead-free solder powder with different composition

Interfacial Reaction and IMC Growth Between the Undercooled Liquid Lead-Free Solder and Cu Metallization