Abstract:Thermal management is key to enabling increasingly powerful chips and heterogeneous integrated 2.5D/3-D systems. Composite materials with high thermal conductivities that can be placed at different levels of proximity to the die provide new solutions for heat dissipation. Here we report the fabrication of thick copper-diamond composite films using cold spray, which is a high-throughput, low-thermal-budget deposition technology. In cold spray, feedstock micro powder is accelerated in a specially designed nozzle by a heated pressurized gas and adheres to the substrate upon high-speed impingement. This process achieves higher deposition rates than other methods used in semiconductor manufacturing (such as electroplating). It also produces films that are denser and much less porous than ones produced by conventional thermal spray techniques. In this work, we first use process and thermal simulations to determine the requirements of the micro diamond powder feedstock, including the diamond core size, metal-clad thickness, core-clad interfacial resistance, and volume fraction to enable the cold spray of copper-diamond composites with thermal conductivities that are higher than copper. Subsequently, we perform a systematic characterization of the diamond powders from several suppliers, including the purity, metal oxygen content, particle morphology, and metal-clad adhesion. This characterization reveals the challenges of meeting all the specs using currently available diamond powders. Finally, we cold spray copper-diamond composite films on a variety of substrates with tunable thicknesses between 100 mm and 2 mm, achieving a thermal conductivity that is approximately 10% higher than cold-sprayed pure copper. Further improvement of the thermal properties relies on continued innovation in powder surface modification and powder storage/shipping methods.

Thin Copper Films Prepared by Chemical Vapor Deposition on Glass-Ceramic Substrates

SEM Research of SiO2 Thin Film on Inner Wall of Glass Container by PECVD

Fabrication and Properties of Transparent Conductive AZO/Cu Bilayer Films

Research of LTCC/Cu, Ag Multilayer Substrate in Microelectronic Packaging

Facile synthesis and electrical performance of silica-coated copper powder for copper electronic pastes on low temperature co-fired ceramic

Characterization of Chemical Vapor Deposited Copper Films on Mercaptan Self-Assembled Monolayer Diffusion Barriers

Effect of High-Frequency and High-Density Current on Adhesive Strength of Copper Thin Film

CaCu33Ti44O1212 Films Prepared by Magnetron S Puttering

Cu metallisation on glass substrate with through glass via using wet plating process

Aerosol Deposition for Ceramic Thick Film Formation at Room Temperature

Research on Copper Circuit Metalization of LTCC in N2 Atmosphere

Influence of the Gas Preheating Temperature on the Microstructure and Electrical Resistivity of Copper Thin Films Prepared via Vacuum Cold Spraying

Submicron Cu@glass core-shell powders for the preparation of conductive thick films on ceramic substrates

Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

Low Temperature CVD Growth of Ultrathin Carbon Films

Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

Deposition of thermal and hot-wire chemical vapor deposition copper thin films on patterned substrates

Electrical and Corrosion Properties of the Ti5Si3 Thin Films Coated on Glass Substrate by APCVD Method

Diluting and Annealing Effects on Electromigration and Morphology of Chemical Vapor-Deposited Copper Films

A New Method to Obtain Cu Films with Lower Resistivity and Higher Interface Adhesion on Different Substrates

Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma