Novel electromagnetic bandgap structure fabricating method

Yunbo Pang,Baoxin Gao,Zhengwei Du
DOI: https://doi.org/10.1109/APS.2002.1017000
2002-01-01
Abstract:This paper presents a new method for fabricating an electromagnetic bandgap structure. The periodic lattice pattern is buried in the substrate. No drilling through the substrate is required, and the integrality of the ground plane is kept. The structure is formed from two circuit boards. The periodic lattice is etched on the top face of the lower board by traditional PCB technology, and buried in the middle of the whole substrate. It is compatible with conventional microstrip circuits. Several circuits with different periodic lattice locations are compared by measurement and FDTD simulation.
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