Modelling solidification process for nickel-based superalloy by cellular automata

Lin Zhang,Wang Yuanming,Zhang Caibei
DOI: https://doi.org/10.3321/j.issn:0412-1961.2001.08.022
2001-01-01
Abstract:A cellular automatum model is developed to study the solidification process for a Ni-based superalloy, based on the temperature diffusion equation, multi-component solute diffusion equation and LGK model used in the growth ahead of dendritic tips. The model is used in simulating the evolution of grain structures in the solidification process under a selected undercooling rate. The heterogeneous nucleation on the mould surface and in the volume of melt, the grain growth, the diffusion procedure and the solid/liquid interface curvature which affect the evolution of the grains microstructure in solidification are discussed respectively.
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