Abstract:Electroless plating combined with photoselective activation is an efficient technique for the selective metallization of dielectric substrates,which is a suitable candidate for high-density packaging and 3-dimensional MIDs (mould interconnection devices).Until now,most work in this area has emplolyed high power and costly laser systems,it is difficult to be used in industry.In recent years,it has been demonstrates that noble metals can be used to catalyze the initial plating of electroless solution.In this study we have chosen three species of palladium salts as photoselective catalytic and studied photolithography direct metal line deposition on ABS substrate using G-line or I-line.Thus,a negative copper pattern can be formed using PdI 2 alone and a positive copper pattern can be obtained using SnCl 2 and PdI 2 together on ABS substrate.

Photoselective Deposition of Copper Lines on ABS Substrates by Electroless Plating