Effects of Para‐ or Meta‐Aromatic Amide Units on The Microstructure, Thermal, Mechanical, Rheological, And Dielectric Properties of Thermotropic Liquid Crystalline Poly(ester Amide)S
Young‐Gi Song,Jin‐Hyeok Park,Feng Tang,Seok‐ju Kim,Tae‐Gyeong Eomm,Minyoung Seo,Young Gyu Jeong,Young Gi Song
DOI: https://doi.org/10.1002/macp.202300354
IF: 2.996
2023-12-06
Macromolecular Chemistry and Physics
Abstract:We report the impact of para‐ and meta‐aromatic amide repeat units on the microstructure, thermal behavior, mechanical properties, rheological characteristics, and dielectric properties of thermotropic liquid crystalline poly(ester amide)s (TPEAs). For this purpose, two distinct series of TPEAs were synthesized using 75.0 mol% of 4‐hydroxybenzoic acid (HBA) and 25.0‐17.5 mol% of 6‐hydroxy‐2‐naphtoic acid (HNA) with 0.0‐7.5 mol% terephthalic acid/para‐acetylaminophenol (TPA/PAP) or isophthalic acid/para‐acetylaminophenol (IPA/PAP) were synthesized via bulk polycondensation reaction. Infrared and electron microscopic data revealed the existence of intermolecular hydrogen bonds and associated fibrillar structures of TPEAs with TPA/PAP‐ or IPA/PAP‐based aromatic amide units. Accordingly, the glass transition temperatures, dynamic storage moduli, and melt viscosities of TPEAs increased with the increment of the aromatic amide units, although they were higher for TPEAs with IPA/PAP‐derived units, compared to TPEAs with TPA/PAP‐derived units. The melting temperatures of TPEAs increased with the para‐aromatic amide unit owing to the intermolecular hydrogen bonding and the rigid linearity, whereas the melting points decreased with the meta‐aromatic amide unit due to the structural nonlinearity. Interestingly, the dielectric constants and losses of TPEAs decreased with the aromatic amide unit content, which was even dominant for TPEAs with IPA/PAP‐based repeat units. Overall, TPEAs with para‐ or meta‐aromatic amide units can be used as high‐performance materials in the industrial sectors of super‐engineering plastics, industrial fibers, printed circuit board materials, etc., requiring enhanced mechanical and thermal transition properties but lower dielectric constants and losses. This article is protected by copyright. All rights reserved
polymer science