Abstract:Loop heat pipe (LHP) is widely used to solve the problem of high heat flux in electronic chips due to its excellent heat transfer efficiency, good thermal equilibrium, and large heat transfer limit. To further improve the heat transfer efficiency of the LHP, a novel LHP was designed with a parallel arrangement of 13 vapor channels (2 mm × 2 mm) capillary wick structure. Experimental investigations were conducted to evaluate the start-up and steady-state performance of the LHP under both regular and random variable loads ranging from 30 W to 180 W. The findings indicate that the LHP exhibits rapid start-up and operates smoothly within the heat load range of 30 W–180 W, maintaining the heat source temperature below 75 °C, thereby meeting the temperature requirements for chip operation.Under a regular variable heat load, the LHP experiences minimal temperature fluctuations, but the system operated with good stability. Meanwhile, under random variable heat loads, the LHP demonstrates quick responsiveness within 5 s and reaches a stable state within 8 min. The temperature fluctuations remain within 2 °C, effectively fulfilling the temperature control demands of electronic devices. Furthermore, the evaporator thermal resistance, condenser thermal resistance, loop thermal resistance and system thermal resistance of the LHP gradually decrease with increasing of heat load. When reaching a heat load of 180 W, the evaporator thermal resistance (Re ), condenser thermal resistance (Rc ), loop thermal resistance (RLHP ), and system thermal resistance (Rsys ) reach their minimum, with values of 0.0168 °C/W, 0.121 °C/W,0.137 °C/W and 0.229 °C/W, respectively. In comparison with other LHPs, the evaporator temperature was only 59.56 °C with the highest heat load of 210 W (52.5 W/cm2), which expanded the application range of the LHP for electronic devices cooling.

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Experimental Study on Loop Heat Pipe with Two-Wick Flat Evaporator

Experimental investigation of loop heat pipe with flat evaporator using biporous wick

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Experimental studies on a high performance compact loop heat pipe with a square flat evaporator

Experimental Research on the Heat Performance of a Flat Copper-Water Loop Heat Pipe with Different Inventories

Experimental Study on Transient Performance of the Loop Heat Pipe with a Pouring Porous Wick

Comparative Study on Thermal Performance of Ultrathin Miniature Loop Heat Pipes with Different Internal Wicks

Experimental Study of a Loop Heat Pipe with Direct Pouring Porous Wick for Cooling Electronics

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Development and Tests of Loop Heat Pipe with Multi-Layer Metal Foams As Wick Structure

Experimental investigation on the thermal performance of a novel loop heat pipe (LHP) with micro-channel structure

Operational characteristics of flat type loop heat pipe with biporous wick

Experimental investigation for the loop heat pipe with a bifacial flat evaporator

Experimental study on a novel loop heat pipe with both flat evaporator and boiling pool

Experimental study on thermal performance of loop heat pipe with a composite-material evaporator for cooling of electronics

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Development of biporous wicks for flat-plate loop heat pipe