A Global Heat Compliance Measure Based Topology Optimization for the Transient Heat Conduction Problem

Chungang Zhuang,Zhenhua Xiong
DOI: https://doi.org/10.1080/10407790.2013.873309
2014-01-01
Abstract:For topology optimization with transient loads, heat compliance varies with transient heat analysis. The peak value of the transient heat compliance should be minimized. Thus, this article proposes a global heat compliance measure to handle this kind of topology optimization for the transient heat conduction problem. The optimization model is then constructed by the global heat compliance measure. The finite-element, equivalent static loads, and continuum shape based sensitivity analyses are derived using the adjoint variable method. Through case studies, the effectiveness of the proposed global heat compliance measure for the transient heat conduction topology optimization is validated.
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