Fabrication of three-dimensional nanoporous Cu-supported tin electrode and its lithium storage performance

PI Ou-yang,HE Zhi-shun,ZHANG Li-ying,WANG Jian-ming,ZHANG Jian-qing,CAO Chu-nan
DOI: https://doi.org/10.19476/j.ysxb.1004.0609.2014.01.021
2014-01-01
Abstract:A three-dimensional (3D) nanoporous copper film with thickness of 5 μm and average pore diameter of 200-300 nm was fabricated by novel dealloying method. The fabrication process involves the heat treatment of the electrodeposited zinc layer on copper substrate and the subsequent acidic leaching of the annealed film. A porous nanostructured tin film electrode was further prepared by the cathodic electrodeposition of tin film on the obtained 3D nanoporous copper film, and its structure and electrochemical properties were investigated by scanning electron microscopy (SEM), X-ray diffractometry (XRD) and galvanostatic charge-discharge tests. The as-prepared porous tin electrode presents an initial reversible lithium storage capacity of 864 mA×h/g at 0.1C, closing to the theoretical capacity of Sn (993 mA×h/g). And it still delivers a reversible capacity of 541 mA×h/g after 50 cycles. The nanoporous structure, nanosized tin particles and 3D porous copper substrate with high electronic conductivity can be responsible for the enhanced lithium storage performance of the porous tin electrode.
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