Abstract:When the grain size is below a critical value, the deformation mechanism of nanocrystalline (NC) metal shifts from dislocation- to grain boundaries (GBs)-mediated activities. However, GB activities including deformation and rotation in the elastic and plastic stages have not given detailed analysis because of the limitation of current experimental techniques, as well as the unrealistic model with regular boundaries in most molecular dynamics (MD) simulation reducing the activities. To quantitatively analyze GB activities, we recently developed an algorithm based on moving least-squares interpolant. Besides, the phase field model was used to build the nanocrystalline (NC) Cu with more natural GBs for MD tensile simulation. The results of temperature dependence of Young's modulus (E), strain rate sensitivity (SRS), and variation of stress at GBs (σGB) and at grain interiors (σGI) are in good agreement with previous researches. In the elastic stage, the σGB fluctuates in a larger range than σGI. The vibrated σGB is the results of micro-elastic and micro-plastic deformation of GBs and the increased stage of σGB in one cycle can lead to increasing the σGI. Thus, the temperature dependence of E is affected by the frequency of vibrated σGB at relative low temperatures (T ≤ 450 K). The E is strain rate independent because of the same vibration of σGB. In the plastic stage, the flow stress strongly depends on the size of twinning boundaries (TBs) structures. The fraction of GB activities improves with increasing temperature and decreasing strain rate. GB activities can attenuate stress concentration on boundaries and then results in the formation and growth mechanism of TB changing from Shockley partial dislocation gliding on adjacent plane of stacking faults (SFs) to GB deformation. Thus, the size of TB at low temperatures and high strain rate is larger than that at the opposite conditions.

Atomic simulations of the effect of twist grain boundaries on deformation behavior of nanocrystalline copper

Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Bending-induced Deformation Twinning in Body-Centered Cubic Tungsten Nanowires

Atomistic Simulations of Tension Properties for Bi-Crystal Copper with Twist Grain Boundary

Atomistic simulation of tensile deformation behavior of ∑5 tilt grain boundaries in copper bicrystal.

Grain Boundary Effects on Plastic Deformation and Fracture Mechanisms in Cu Nanowires: Molecular Dynamics Simulations

Roles of grain boundary and dislocations at different deformation stages of nanocrystalline copper under tension

Molecular Dynamics Study on Tensile Strength of Twist Grain Boundary Structures under Uniaxial Tension in Copper

Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

Grain boundaries dependence of plastic deformation in nanocrystalline Cu film investigated by phase field and molecular dynamics methods

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Effect of stress state on deformation and fracture of nanocrystalline copper： Molecular dynamics simulation

Atomic-scale modeling of the deformation of nanocrystalline metals

Influences of Symmetric Tilt Grain Boundary on the Stretching Deformation Behaviors of Cu Bicrystals

Atomistic Simulation of the Strain-Hardening Behavior of Bicrystal Cu Nanowires

Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength

Molecular Dynamical Investigation on Plastic Behavior of Cu(100) Twist-Grain Boundary under Uniaxial Tension

Molecular Dynamics Simulation of Surface Effect on Tensile Deformation of Single Crystalline Copper

Molecular Dynamical Investigation on Plastic Behavior of Cu(100) Twist-Grain Boundary under Shear Load

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton