Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Xiaoguo Song,Jian Cao,Haiyan Chen,Houqin Wang,Jicai Feng
DOI: https://doi.org/10.1016/j.matdes.2012.11.044
IF: 9.417
2013-01-01
Materials & Design
Abstract:Contact reactive brazing of Ti53311S alloy was extensively evaluated using Cu foil as interlayer within the range of 940-1020 degrees C for 10 min. Effect of brazing temperature on the interfacial microstructure and its evolution as well as joining properties were investigated in detail. TiCu and Ti3Cu4 intermetallic compounds formed in joint by isothermal solidification and peritectic reaction (TiCu + L -> Ti3Cu4) when the brazing temperature was 940 degrees C. A eutectoid microstructure consisting of alpha-Ti and Ti2Cu phases was produced by the eutectoid reaction (beta-Ti -> alpha-Ti + Ti2Cu) in joint when brazed at 960-1000 degrees C. Whereas when brazing was conducted at 1020 degrees C (above the alpha -> beta transus temperature 1010 degrees C), Lamellar(alpha + beta) structure was obtained in joint by isothermal solidification and subsequent phase transformation. Tensile test indicated that the maximum average tensile strength reached 932.6 MPa at room temperature. Brittle fractures were observed in all of the brazed specimens although the fracture mode was different. (C) 2012 Elsevier Ltd. All rights reserved.
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