Abstract:Epoxy resin nanocomposites are widely used in the field of electrical insulation packaging. It is of great significance to regulate the dielectric and insulation properties of composite materials by introducing nano-filler to meet special application requirements. This work proposes a chemical copolymerization method, fluorinated polystyrene nanospheres are synthesized through an addition reaction as filler, and finally the epoxy nanocomposites are prepared. The polystyrene nanospheres have a uniform size and good compatibility with the epoxy resin. The introducing of nanospheres reduces the dielectric constant of the epoxy resin composite material and increases the breakdown strength simultaneously. Although the dielectric loss increases, the composites' imaginary part remains below 0.04 within 1 MHz frequency. In particular, the fluorinated polystyrene/epoxy composite with a mass fraction of 2% exhibits a decrease in dielectric constant and DC conductivity, while the AC breakdown strength and DC breakdown strength increase by 12.6% and 6%, respectively. The results of the pulse electro-acoustic method indicate that the charge injection of the epoxy resin filled with non-fluorinated polystyrene nanospheres is evident, while the introduction of fluorinated nanospheres significantly reduces the charge injection level. Calculations based on the depolarization process reveal that the introduction of fillers leads to an increase in trap density and depth of energy levels in the composites. Notably, the epoxy resin filled with fluorinated fillers has the deepest trap levels, providing an explanation for the improved insulation breakdown performance. The research can provide guidance for regulating dielectric properties of epoxy composites and material synthesis for the application of electrical insulation packaging.

Fabrication, structure, and property of epoxy-based composites with metal-insulator core-shell structure fillers

Improving Insulation Properties of Epoxy Filled with Surface Fluorinated Polystyrene Nanospheres

Behavior of epoxy resin filled with nano-SiO<sub>2</sub> treated with a Eugenol epoxy silane

Dielectric Properties and Thermal Conductivity of Epoxy Composites Using Core/shell Structured Si/SiO2/Polydopamine

The Effect of Ag@SiO2 Core‐shell Nanoparticles on the Dielectric Properties of PVDF Based Nanocomposites

The influences of different sizeSiO(2)nanoparticles on dielectric properties and corona resistance of epoxy composites

Dielectric properties and thermal conductivity of epoxy composites using quantum-sized silver decorated core/shell structured alumina/polydopamine

The influences of different size SiO 2 nanoparticles on dielectric properties and corona resistance of epoxy composites

Enhanced High Thermal Conductivity and Low Permittivity of Polyimide Based Composites by Core-Shell Ag@Sio2 Nanoparticle Fillers

A Rational Design of Core-Shell-satellite Structured BaTiO3 Fillers for Epoxy-Based Composites with Enhanced Microwave Dielectric Constant and Low Loss

Synergetic Enhancement of Mechanical and Electrical Strength in Epoxy/silica Nanocomposites Via Chemically-Bonded Interface

Enhanced Performance of Porous Silicone-Based Dielectric Elastomeric Composites by Low Filler Content of Ag@SiO2 Core-Shell Nanoparticles

Interfacial Effect on Dielectric Properties of Polymer Nanocomposites Filled with Core/Shell‐Structured Particles

Tuned Local Surface potential of Epoxy Resin Composites by Inorganic Core-Shell Microspheres: The key roles of interface.

Study on Structural and Functional Properties of Porous SiO 2 Core‐shell Construction/polyethylene Nanocomposites with Enhanced Interfacial Interaction

Dielectric Performance of Polymer-Based Composites Containing Core-Shell Ag@TiO2 Nanoparticle Fillers

Enhanced Thermal Conductivity of Epoxy Composites with Core-Shell SiC@SiO2 Nanowires

Al@SiO2 Core–Shell Fillers Enhance Dielectric Properties of Silicone Composites

High-Performance Epoxy/Silica Coated Silver Nanowire Composites As Underfill Material for Electronic Packaging

Investigation of Dielectric and Thermal Conductive Properties of Epoxy Resins Modified by Core-Shell Structured PS@SiO 2

Influence of Grafting Modification on Dielectric Properties of Epoxy-Grafted SiO2/Epoxy Composites