Microstructural Evolution with a Wide Range of Solidification Cooling Rates in a Ni-Based Superalloy

Yongjun Zhang,Bin Huang,Jianguo Li
DOI: https://doi.org/10.1007/s11661-013-1645-7
2013-01-01
Metallurgical and Materials Transactions A
Abstract:At a wide range of solidification cooling rates in various cooling effect solidification processes, the solid/liquid interface experiences planar, cellular, dendritic, and superfine-cellular morphologies, and an approximately linear correlation is shown between the logarithmic representations of dendrite arm spacing and solidification cooling rate in a Ni-based superalloy. The relationship between dendrite arm spacing and cooling rate was established by statistical analysis data in a wide range of Ni-based superalloys from the literature. It can be used comprehensively to evaluate dendritic growth at given cooling conditions in the fabrication of Ni-based superalloys.
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