Graphene interconnects fully encapsulated in layered insulator hexagonal boron nitride.

Nikhil Jain,Chris A Durcan,Robin Jacobs-Gedrim,Yang Xu,Bin Yu
DOI: https://doi.org/10.1088/0957-4484/24/35/355202
IF: 3.5
2013-01-01
Nanotechnology
Abstract:We demonstrate improvements in the electrical performance of graphene interconnects with full encapsulation by lattice-matching layered insulator, hexagonal boron nitride (h-BN). A novel layer-based transfer method is developed to assemble the top passivating layer of h-BN on the graphene surface to construct the h-BN/graphene/h-BN heterostructures. The encapsulated graphene interconnects (EGIs) are characterized and compared with graphene interconnects on either SiO2 or h-BN substrates with no top passivating h-BN layer. We observe significant improvements in both the maximum current density and breakdown voltage in EGIs. Compared with the uncovered structures, EGIs also show an appreciable increase (similar to 67%) in power density at breakdown. These improvements are achieved without degrading the carrier transport characteristics in graphene wires. In addition, EGIs exhibit a minimal environment impact, showing electrical behavior insensitive to ambient conditions.
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