Abstract:Acrylonitrile-modified aliphatic amine adducts are often used as curing agents for room-temperature epoxy formulations (coatings, adhesives, sealants, castings, etc.), yet the curing reaction and properties of resultant epoxy systems still remain less fundamentally understood. Herein we systematically investigate our newly-developed acrylonitrile-modified multifunctional polyamine curing agent for bisphenol A epoxy resin (DGEBA): an aciylonitrile-capped poly(propyleneimine) dendrimer (PAN4). The impact of the molecular structure of PAN4 and a controlled poly(propyleneimine) dendrimer (1.0GPPI) on the curing reactivity, reaction mechanisms, thermal stability, viscoelastic response and mechanical properties of the epoxy systems are highlighted. Differential scanning calorimetry (DSC) confirms DGEBA/PAN4 shows markedly lower reactivity and reaction exotherm than DGEBA/1.0GPPI, and the model-free isoconversional kinetic analysis reveals that DGEBA/PAN4 has the generally lower reaction activation energy. To be quantitative, the progress of the isothermal cure is predicted from the dynamic cure by using the Vyazovkin equation. The isothermal kinetic prediction shows that DGEBA/PAN4 requires about 10 times longer time to achieve the same conversion than DGEBA/1.0GPPI, which agrees with the experimentally observed much longer gel time of DGEBA/PAN4. Subsequently, dynamic mechanical analysis shows that PAN4 results in the cured epoxy network with the lower beta- and glass-relaxation temperatures, crosslink density, relaxation activation energy, enthalpy, entropy, but the higher damping near room temperature than 1.0GPPI. Finally, thermogravimetric analysis (TGA) demonstrates cured DGEBA/PAN4 is thermally stable up to 200 degrees C, and mechanical property tests substantiate that PAN4 endows the cured epoxy with much higher impact and adhesion strengths than 1.0GPPI. Our data can provide a deeper insight into acrylonitrile-modified aliphatic amine curing agents from the two good model compounds (PAN4 and 1.0GPPI). (C) 2012 Elsevier B.V. All rights reserved.

Investigation Of Curing Kinetics Of Sodium Carboxymethyl Cellulose/Epoxy Resin System By Differential Scanning Calorimetry

The Curing Behavior and Properties of Diglycidyl Ether of 4,4′-Bis(4-hydroxybenzoyloxy)-3,3′,5,5′-tetramethylbiphenyl and Its Composites with Multi-Wall Carbon Nanotubes

Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Cure Kinetics of Carbon Nanotube/tetrafunctional Epoxy Nanocomposites by Isothermal Differential Scanning Calorimetry

Model-Fitting and Model-Free Nonisothermal Curing Kinetics of Epoxy Resin with A Low-Volatile Five-Armed Starlike Aliphatic Polyamine

Evaluating a Four-Directional Benzene-Centered Aliphatic Polyamine Curing Agent for Epoxy Resins

Nonisothermal reaction kinetics of DGEBA with four-armed starlike polyamine with benzene core (MXBDP) as novel curing agent

Cure Kinetic Study of Carbon Nanofibers/Epoxy Composites by Isothermal Dsc

Effects of the Heating Rate and the Amount of Organic Montmorillonite on the Thermal Properties of the Novel Liquid Crystalline Epoxy Nanocomposite

Acrylonitrile-Capped Poly(Propyleneimine) Dendrimer Curing Agent for Epoxy Resins: Model-Free Isoconversional Curing Kinetics, Thermal Decomposition and Mechanical Properties

STUDY OF CURING BEHAVIORS OF CARBON NANOTUBES/EPOXY COMPOSITES

Isothermal kinetics and thermodynamics studies of curing reaction of epoxy-aromatic diamine reinforced with epoxy functional MWCNT

Cure Kinetics of Epoxy Resin Used for Advanced Composites

The Curing Kinetics Analysis of Four Epoxy Resins Using a Diamine Terminated Polyether as Curing Agent

Cure Kinetics Characterization Of Epoxy Resin By Piecewise Model Fitting Method

Reliability evaluation of a new method developed for DSC curing kinetic model of epoxy resin

Cure Kinetics of Epoxy-Based Nanocomposites Analyzed by Avrami Theory of Phase Change

Curing and Molecular Dynamics Simulation of MXene/Phenolic Epoxy Composites with Different Amine Curing Agent Systems

DSC Study on the Effect of Cure Reagents on the Lignin Base Epoxy Cure Reaction

CURING KINETIC MODEL OF THE 2-ETHYL-4-METHYLIMIDAZOLE/EPOXY SYSTEM