Thermal Properties and Flame Retardancy of Novel Epoxy Based on Phosphorus‐modified Schiff‐base

Huan Liu,Kai Xu,Hualun Cai,Jiangxun Su,Xin Liu,Zien Fu,Mingcai Chen
DOI: https://doi.org/10.1002/pat.1832
IF: 3.348
2012-01-01
Polymers for Advanced Technologies
Abstract:Through addition reaction of Schiff-base terephthalylidene-bis-(p-aminophenol) (DP-1) and diethyl phosphite (DEP), a novel phosphorus-modified epoxy, 4,4'-diglycidyl-(terephthalylidene-bis-(p-aminophenol))diphosphonate ether (EP-2), was obtained. An modification reaction between EP-2 and DP-1 resulted in an epoxy compound, EP-3, possessing both phosphonate groups and C?N imine groups. The structure of EP-2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), 1H, 13C, and 31P NMR analyses. The thermal properties of phosphorus-modified epoxies cured with 4,4'-diaminodiphenylmethane (MDA) and 4,4'-diaminodiphenyl ether (DDE) were studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The activation energies of dynamic thermal degradation (Ed) were calculated using Kissinger and Ozawa's methods. The thermal degradation mechanism was characterized using thermogravimetric analysis/infrared spectrometry (TG-IR). In addition, the flame retardancy of phosphorus-modified epoxy thermosets was evaluated using limiting oxygen index (LOI) and UL-94 vertical test methods. Via an ingenious design, phosphonate groups were successfully introduced into the backbone of the epoxies; the flame retardancy of phosphorus-modified epoxy thermosets was distinctly improved. Due to incorporation of CN imine group, the phosphorus-modified epoxy thermosets exhibited high thermal stabilities; the values of glass-transition temperatures (Tgs) were about 201210 degrees C, the values of Ed were about 220490kJ/mol and char yields at 700 degrees C were 4953% in nitrogen and 4550% in air. These results showed an improvement in the thermal properties of phosphorus-modified epoxy by the incorporation of C?N imine groups. Copyright (C) 2010 John Wiley & Sons, Ltd.
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