Abstract:In this communication, a corporate stacked microstrip and substrate integrated waveguide (SIW) feeding structure is reported to be used to broaden the impedance bandwidth of a $4 imes 4$ patch array antenna. The proposed array antenna is based on a multilayer printed circuit board structure containing two dielectric substrates and four copper cladding layers. The radiating elements, which consist of slim rectangular patches with surrounding U-shaped parasitic patches, are located on the top layer. Every four radiation elements are grouped together as a $2 imes 2$ subarray and fed by a microstrip power divider on the next copper layer through metalized blind vias. Four such subarrays are corporate-fed by an SIW feeding network underneath. The design process and analysis of the array antenna are discussed. A prototype of the proposed array antenna is fabricated and measured, showing a good agreement between the simulation and measurement, thus validating the correctness of the design. The measured results indicate that the proposed array antenna exhibits a wide $vert ext {S}_{11}vert < -10$ dB bandwidth of 17.7%, i.e., 25.3–30.2 GHz, a peak gain of 16.4 dBi, a high radiation efficiency above 80%, and a good orthogonal polarization discrimination of higher than 30 dB. In addition, the use of low-profile substrate in the SIW feeding network makes this array antenna easier to be integrated directly with millimeter-wave front-end integrated circuits. The demonstrated array antenna can be a good candidate for various Ka-band wireless applications, such as 5G, satellite communications and so on.

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