Statistical Modeling-Based Image Matching Algorithm for Solder Joints of Electronic Components

Hao Wu,Xian-min Zhang,Yong-cong Kuang,Gao-fei Ouyang,Hong-wei Xie
DOI: https://doi.org/10.3969/j.issn.1000-565X.2012.01.012
2012-01-01
Abstract:In order to reduce the programming time and overcome the experience dependence on the existing automatic optical inspection (AOI) systems based on feature extraction, an image matching algorithm based on statistical modeling is proposed. In this algorithm, first, qualified sample images of solder joints are separated from the unqualified ones in training. Next, a standard learning template image is formed through a gray-level statistical modeling of the qualified sample images. Then, after an alignment, the component image to be tested is matched with the trained template image. Finally, the difference in pixel point gray is calculated and is used to determine whether the testing component image is qualified or not. Experimental results show that the proposed algorithm, with a false alarm rate of less than 2% and a missing report rate of O, helps to obtain satisfying accuracy of AOI and greatly reduces the programming time of users for inspection.
What problem does this paper attempt to address?