THE STRUCTURE CHARACTERISTICS OF SULFONATED LIGNIN-BASED POLYMER AND ITS ADSORPTION PROPERTIES ON ALUMINA

Wen-yuan Guo,Dong-jie Yang,Rong Li,Xue-qing Qiu
DOI: https://doi.org/10.3724/sp.j.1105.2012.11411
2012-01-01
Abstract:A sulfonated lignin-based polymer, SBAL, was prepared by sulfomethylation, etherification and polycondensation reaction using alkali lignin from the alkaline pulping spent liquor of bamboo as main material. TEM and H-1-NMR results showed that the structure of SBAL was loose spherical, the center of which was the hydrophobic skeletons of lignin, the long side chains with sulfonic and carboxyl groups were distributed on its surface. GPC and potentiometric titration results showed that the M-w of SBAL reached 24880 Da, 7.38 times of the alkali lignin, and the sulfonic group content was 2.70 mmol . g(-1). The adsorption properties and the dispersion efficiencies of SBAL were investigated by means of isothermal adsorption, XPS, zeta potential and rheological experiments. At pH 3 similar to 12, the SBAL as dispersant can remarkably reduce the viscosity of alumina slurry. The sulfonic, carboxyl and phenolic hydroxyl groups of SBAL are ionized gradually as pH increasing, which makes the SBAL molecule chains spread well in the alkali condition. With the increase of pH, the adsorption amount of SBAL on alumina particles decreases and the adsorption configuration changes from compact to loose. When pH is lower than isoelectric point of alumina, the main adsorption force between SBAL and alumina particle is electrostatic adsorption, however, when pH is more than isoelectric point, non-static specific adsorption dominates the main force. When the dosage of SBAL is less than the critical dosage (0.5 wt%), SBAL generates an electrostatic repulsion between particles by monolayer adsorption on alumina surface, moreover, when the SBAL dosage is more than the critical one, SBAL may adsorb on alumina particles in the form of aggregation and improve the steric hindrance action.
What problem does this paper attempt to address?