Abstract:Due to the increasing cost of Au, the semiconductor industry has gone through a dramatic shift away from Au wire bonding to Cu wire bonding. Pd-coated Cu (PdCu) wire has become the favored wire choice over bare Cu wire for fine pitch applications. The advantages of PdCu wire include better HAST reliability results and a more stable stitch bond process window. This paper will examine the critical aspect of bringing Cu and PdCu wire technology from chip design to wire bonding process development to qualification, reliability test and final production. Chip design needs to take into consideration the requirement of Cu wire bonding. Compared to Au wire bonding, Cu wire bonding has many more challenges including pad material push out (pad splash), Al layer peel off (pad peel) and crack in the barrier and dielectric layer (pad crack). This paper considers the impact of various pad structures & metallization to PdCu wire assembly quality and reliability. Because of the unique challenges facing Cu wire bonding processes, wire bonding process development becomes one of the bottlenecks in the assembly process. To shorten the development cycle and ease the requirement for extensive Design Of Experiments (DOEs), a new model based approach was developed and implemented on the latest Cu wire bonder. With this approach, the bonding parameters are calculated based on numerical models. It reduces the need for parameter optimization. This paper will also discuss how modifications and newly developed metrology tools are used in the optimization of PdCu wire. Because of the narrow process window in Cu and PdCu wire bonding, achieving reliable production and high yields requires the process to have a sustainable process window and be portable and transferable to multiple machines and be robust across material variations commonly encountered in a production environment. This paper examines the methods used in quantifying process windows and portability of the wire bonding equipment to ensure high reliability for the end product. Development and optimization of PdCu wire bonding requires a fundamental understanding of interfacial reaction in bonds during both bonding and reliability tests, as proper formation of intermetallic compounds is beneficial to bonding strength. While the knowledge of intermetallic growth in bare copper wire bonds on aluminum has become well established in the past five years, there is little literature in terms of the morphology and growth of intermetallic phase between PdCu wire and Al pad. This paper ascertains the intermetallic growth and phase transformation, retention of aluminum oxide, and behavior of palladium in PdCu wire bonds using high resolution transmission electron microscopy (HRTEM) of dual beam focused ion beam (FIB) thinned specimens.

Discussion the Characteristics of Coating Pd Copper Wire Bonding

Pd-coated Cu wire bonding technology: Chip design, process optimization, production qualification and reliability test for high reliability semiconductor devices

Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire

Enhanced Tensile Properties And Fracture Reliability Of Cu-Based Amorphous Wires Via Pr-Doping

Analysis of Promising Copper Wire Bonding in Assembly Consideration

Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium

Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

Diffusion and reaction behavior of palladium coating and copper matrix prepared using a halogen-free direct coating process

Effects of Pd Alloying and Coating on the Galvanic Corrosion between Cu Wire and Bond Pads for a Semiconductor Packaging

High temperature degradation of palladium coated copper bond wires

Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer

Comparison of the Microstructural Characteristics and the Electrothermal Fracture Mechanism of Au-Pd-Coated Copper Wire and Cu-Ti Micro-alloyed Wire

Characteristics of Copper Wire Wedge Bonding

Copper Wire Bonding: A Review

Development of copper wire bonding technology

Effect of electro-thermal diffusion induced deterioration on the failure mechanism of Pd-Au-coated Cu wires

Study of tensile properties, electrothermal characteristics and packaging reliability on Cu–Pt–Au–Pd fine micro-alloyed wire

Contrast Research on the Reliability of Gold and Copper Wire/Ball Bonding

Progress in ultrasonic bonding wire process and quality evaluation of bonding point

Study of bonding parameters with Al and Au wires on Pd and Ag coatings