Finite Element Analyses of Interface Delamination for 3D Piezoelectric Laminated Beam with Actuator Debonding

BAI Rui-xiang,WANG Liang,SHI Ye-jin,CHEN Bao-xing
DOI: https://doi.org/10.3969/j.issn.1674-1404.2011.06.015
2011-01-01
Abstract:Three-dimensional non-linear finite element analyses have been carried out for piezoelectric laminated beams with piezoelectric actuator partially debonding subjected to applied voltage to study the growth of adhesion failure and delamination behavior.Based on VCCT,a fracture element,named as 3D-VCCT interface fracture element,was developed in conjunction with commercial FEA software ABAQUS by its user-defined element(UEL)feature.The three individual modes energy release rate was calculated with 3D-VCCT interface fracture element and the B-K criteria of delamination growth was used.The influence of the different ply angles of laminated beams and different thickness ratios of laminated beam on the delamination growth behavior was investigated.Based on the calculating results,it is found that the adhesion failure would propagate under mixed mode condition shearing mode of which was the governing mode.
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