Hot Deformation Behavior and Microstructure Evolution Mechanisms of Ti6Al4V Alloy under Hot Stamping Conditions
Mingjia Qu,Zhengwei Gu,Xin Li,Lingling Yi,Yi Li,Ge Yu,Yafu Zhao
DOI: https://doi.org/10.3390/ma17112531
IF: 3.4
2024-05-25
Materials
Abstract:Through the study of the thermal rheological behavior of Ti6Al4V alloy at different temperatures (500 °C, 600 °C, 700 °C, and 800 °C) and different strain rates (0.1 s−1, 0.05 s−1, 0.01 s−1, and 0.005 s−1), a constitutive model was developed for Ti6Al4V alloy across a wide temperature range in the hot stamping process. The model's correlation coefficient reached 0.9847, indicating its high predictive accuracy. Hot processing maps suitable for the hot stamping process of Ti6Al4V alloy were developed, demonstrating the significant impact of the strain rate on the hot formability of Ti6Al4V alloy. At higher strain rates (>0.05 s−1), the hot processing of Ti6Al4V alloy is less prone to instability. Combining hot processing maps with hot stamping experiments, it was found that the forming quality and thickness uniformity of parts improved significantly with the increase in stamping speed. The phase composition and microstructures of the forming parts under different heating temperature conditions have been investigated using SEM, EBSD, XRD, and TEM, and the maximum heating temperature of hot stamping forming was determined to be 875 °C. The recrystallization mechanism in hot stamping of Ti6Al4V alloys was proposed based on EBSD tests on different sections of a hot stamping formed box-shaped component. With increasing deformation, the effect of dynamic recrystallization (DRX) was enhanced. When the thinning rate reached 15%, DRX surpassed dynamic recovery (DRV) as the dominant softening mechanism. DRX grains at different thinning rates were formed through both discontinuous dynamic recrystallization (DDRX) and continuous dynamic recrystallization (CDRX), with CDRX always being the dominant mechanism.
materials science, multidisciplinary,metallurgy & metallurgical engineering,physics, applied,chemistry, physical, condensed matter