SPICE Compatible Modelling of On-Chip Coupled Interconnects

R. Kumar,K. Kang,S. C. Rustagi,K. Mouthaan,T. K. S. Wong

DOI: https://doi.org/10.1049/el:20072620

2007-01-01

Electronics Letters

Abstract:On-chip coupled interconnect lines are modelled using measured S-parameters. The physical consistency between single and coupled line model parameters are maintained in the proposed methodology. The SPICE compatible model is validated in both the frequency and the time domain using copper and ultra low-kappa coupled interconnects.