Optimize RTR(Roll to Roll)Producing Parameters for 25μm/25μm COF Fine Lines

刘尊奇,张胜涛,何为,莫芸绮,周国云,倪乾峰,金轶,何波,陈浪,王淞,林均秀

DOI: https://doi.org/10.3969/j.issn.1009-0096.2009.09.012

2009-01-01

Abstract:With the miniaturization of electronic products and fast development of Liquid Crystal Display IC encapsulation technology, the application market of COF(Chip on Film) technology expand rapidly. When producing thinner than 50μm/50μm fine lines according to traditional method, there always are objections of gaps on line or under size lines. In this paper we adopt advanced production process of RTR(Roll to Roll), select 12μm copper foil and 15μm dry film, transfer diagram by glass film and use uniform design to optimize the factors of the exposure energy, exposure speed, etching speed and etching pressure which effect the quality of fine fines. We use the width of the fine lines and etching coefficient as estimation standards to find the perfect parameters as well as analyze the theory of etching pressure influence in producing fine lines. By applying the perfect parameters in production, the rate of finished products of the 25μm/25μm fine lines board increase 20%. Eventually, we achieve small volume production of 25μm/25μm fine lines.