Computer Simulation of Flip-Chip Underfill Encapsulation Process Using Meshfree Particle Method.
M. B. Liu,G. R. Liu,K. Y. Lam
DOI: https://doi.org/10.1142/s1465876303001381
2003-01-01
International Journal of Computational Engineering Science
Abstract:International Journal of Computational Engineering ScienceVol. 04, No. 02, pp. 405-408 (2003) Design, Modelling and SimulationNo AccessCOMPUTER SIMULATION OF FLIP-CHIP UNDERFILL ENCAPSULATION PROCESS USING MESHFREE PARTICLE METHODM. B. LIU, G. R. LIU, and K. Y. LAMM. B. LIUCentre for ACES, Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore Search for more papers by this author , G. R. LIUCentre for ACES, Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore Search for more papers by this author , and K. Y. LAMCentre for ACES, Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, Singapore Search for more papers by this author https://doi.org/10.1142/S1465876303001381Cited by:4 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe underfill encapsulation process is very important in the flip-chip technology for advanced IC packaging. This paper presents the application of smoothed particle hydrodynamics (SPH) to simulate the complex underfill encapsulation process. The incompressible flow in the micro channel between the chip and the substrate is modeled as an artificially compressible flow. The simulation result of the underfill encapsulation agrees well with the analytical solution.Keywords:Underfill encapsulationSmoothed particle hydrodynamicsMicro channel flow References S. J. Han and K. K. Wang, Analysis of the flow of encapsulant during underfill encapsulation of flip-chip, IEEE Transactions on components, packaging, and manufacturing technology, past B, 20 (4) (1997):424-433 . Google Scholar Z. H. Gao, H. Xue and G. R. Liu, Computational simulation of flip-chip underfill encapsulation process, Proceedings of the 5th International Symposium on Heat Transfer, (2000), Beijing . Google Scholar R. A. Gingold and J. J. Monaghan, Smoothed Particle Hydrodynamics: Theory and Application to Non-spherical stars, Monthly Notices of the Royal Astronomical Society 181, (1977):375-389 . Google ScholarM. B. Liu, G. R. Liu and K. Y. Lam, Shock Waves 12(3), 181 (2002). Crossref, Google ScholarM. B. Liuet al., Computational Mechanics 30(2), 106 (2003). Crossref, Google ScholarJ. P. Morris, P. J. Fox and Y. Zhu, Journal of Computational Physics 136, 214 (1997). Crossref, Google Scholar FiguresReferencesRelatedDetailsCited By 4Numerical implementation of deformation and motion of droplet at the interface between vapor and solid surface with smoothed particle hydrodynamics methodology Qiang Hong-Fu, Liu Kai and Chen Fu-Zhen1 Jan 2012 | Acta Physica Sinica, Vol. 61, No. 20MODELING OF CONTACT ANGLES AND WETTING EFFECTS WITH PARTICLE METHODSM. B. LIU, J. Z. CHANG, H. T. LIU, and T. X. SU20 November 2011 | International Journal of Computational Methods, Vol. 08, No. 04Smoothed Particle Hydrodynamics (SPH): an Overview and Recent DevelopmentsM. B. Liu and G. R. Liu13 February 2010 | Archives of Computational Methods in Engineering, Vol. 17, No. 1AN OVERVIEW ON SMOOTHED PARTICLE HYDRODYNAMICSM. B. LIU, G. R. LIU, and Z. ZONG20 November 2011 | International Journal of Computational Methods, Vol. 05, No. 01 Recommended Vol. 04, No. 02 Metrics History KeywordsUnderfill encapsulationSmoothed particle hydrodynamicsMicro channel flowPDF download