High Temperature Direct Double Side Cooled Inverter Module for Hybrid Electric Vehicle Application
Cyril Buttay,C. Mark Johnson,Jeremy Rashid,Florin Udrea,Gehan A. J. Amaratunga,Peter Tappin,Nicholas Wright,Peter Ireland,Takeo Yamamoto,Yuuichi Takeuchi,Rajesh Kumar Malhan
DOI: https://doi.org/10.4028/www.scientific.net/msf.556-557.709
2007-01-01
Materials Science Forum
Abstract:In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, doublesided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.