Microstructure and Properties of W Cu Composites with Low Copper Content at Different Sintering Temperatures
Xi-Peng Ding,Wan-Nan Xu,Lai-Ma Luo,Yong-Qiang Qin,Yu-Cheng Wu
DOI: https://doi.org/10.1016/j.ijrmhm.2023.106219
IF: 4.804
2023-01-01
International Journal of Refractory Metals and Hard Materials
Abstract:For the tungsten-copper composite salt solution prepared using the wet chemical method, micron-sized W-10/15wt.%Cu precursors with hollow spherical shell shape were prepared by spray drying. They were then subjected to hydrogen reduction to obtain irregularly shaped nanoscale W-10/15wt.%Cu composite powders, which were pressed under cold isostatic pressure to obtain high-density green bodies without forming agent and lower pressing force. Different densification processes were carried out at different sintering temperatures, thus remarkably influencing the microstructure and properties of W-Cu composites. At sintering temperature of 1350 degrees C, W-10/15wt.%Cu composites reached the maximum relative densities of 97.5 and 98.2 g/cm(3), respectively, and exhibited the best thermal and mechanical properties. W-10wt.%Cu composites had a high thermal conductivity (TC) of 195 W/(m center dot K), coefficient of thermal expansion (CTE) of 6.20 ppm/degrees C, hardness of 346 HV, and flexural strength of 1146 MPa. W-15wt.%Cu composites also showed excellent performance with TC of up to 208 W/(m center dot K), CTE of 7.13 ppm/degrees C, hardness of 328 HV, and flexural strength of 806 MPa. The W-10/15wt.%Cu composites prepared in this study were of great application in the field of electronic packaging.