Statistical recognition and analysis research in the infrared thermal images of power package

WAN Shou-Hong,LI Xin-Hua
DOI: https://doi.org/10.3969/j.issn.1000-2162.2006.01.005
2006-01-01
Abstract:Expert knowledge database can be created by statistic analysis of training sample,after auto-matic focusing and extracting feature parameters which are very useful to classify different solder condition in infrared thermal images of the semiconductor power package.In this paper,a minimum feature-weighted block distance classifier is used to realize recognition quickly and accurately.Quantitative analysis of flaws is realized by using the method of selecting threshold automatically based on AI to segment the flows for the soldering flows condition.
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