Feasibility Analysis of Wedge Bonding Process Using Bonding Capillaries

XIA Zhiwei,LIU Yanqing,JI Wei,GAO Yue

DOI: https://doi.org/10.3969/j.issn.1004-4507.2012.11.003

2012-01-01

Abstract:There are two different equipments which using different Ultrasonic Transducer,Bonding Tool and Bonding Process in the traditional bonding technology.They are ball bonding and wedge bonding equipment.In this paper,comparing the two Bonding process`s common points we analyze and generalize the feasibility that wedge bonding using Bonding capillaries by transforming equipment,testing appearance of bump and force of bonding.