Micro-/nano-scale structure and elemental diffusion in the Al/Ti/Al sandwich structure
Mingfu Liu,Cunsheng Zhang,Haibin Zhao,Zijie Meng,Liang Chen,Guoqun Zhao
DOI: https://doi.org/10.1016/j.jmrt.2023.05.204
IF: 6.267
2023-05-25
Journal of Materials Research and Technology
Abstract:To reveal the complexities of microstructures at the Al/Ti interface, Al/Ti/Al sandwich structures are produced through thermal pressing and annealing treatment. The multi-scale interface structures, elemental diffusion, grain characteristics, and micromechanics are explored by scanning electron microscopy (SEM), electron back-scattered diffraction (EBSD), transmission electron microscopy (TEM), and nano-indentation. The results indicate only TiAl 3 is generated at the interface, and the interlayer thickness and TiAl 3 grain size increase with rising temperature. On the microscale, a compact interlayer is visible at 500 and 550 °C, whereas massive Al-enriched bulks are dispersed in the interlayer as the temperature increases to 650 °C. Abnormal micro-defects at 600 and 650 °C are partially formed with the thickening of the interlayer and the segregation of Mg and Si. Unexpectedly, interfacial microvoids, amorphous layers, and oxides are detected, which hinder the growth of the interlayer. On the nanoscale, misfit dislocations and lattice distortions are noticed at the interface. More interestingly, the Ti–Al solid solution structures with severe lattice misfits are generated on the three-dimensional (3D) Ti/TiAl 3 interface, which is considered to be a novel strategy for enhancing the strength-plasticity synergy of composite structures.
materials science, multidisciplinary,metallurgy & metallurgical engineering