Effect of Milling Pretreatment to Powders on Microstructure and Physical Properties of Al-Si Alloy Materials

杨伏良,易丹青,喻盈捷,李伟滋
DOI: https://doi.org/10.3901/jme.2009.01.253
2009-01-01
Journal of Mechanical Engineering
Abstract:In order to fabricate high silicon content aluminum alloys electronic packaging materials,Al_2O_3 and SiO_2 dispersion strengthened metallic matrix composites (MMCs) are made by pretreatment of high-energy milling for the AI-Si alloy powder prior to hot-extrusion.The microstructure,density,air tightness,coefficient of thermal expansion and thermal conductivity (TC) are analyzed by using transmission electron microscope (TEM),metaUographic microscope and thermal physical testers.Experimental results indicate the following:After Al-Si alloy powders are milled,the material grains,especially Si grains are smaller than those of the high-temperature air oxidation.The material density is close to the theoretical density,and the relative density is about 99%.The air tightness is very good and less than 1 nPa·m~3·s~(-1).The coefficient of thermal expansion decreases with prolonging milling time and less than 13μK~(-1)after the powder is milled for 24 h.Thermal conductivity increases with prolonging milling time,after the powder is milled for 32 h,TC is up to 145.5 W·m~(-1)·K~(-1).
What problem does this paper attempt to address?