Abstract:The stress characteristics in the anisotropic bicrystal and tricrystal specimens were analyzed using the anisotropic elastic model, orthotropic Hill's model and rate-dependent crystallographic model. The finite element analysis results show that non-uniform stresses are induced by the grain boundary. For bicrystal specimens in different crystallographic orientations, there exist stress concentrations and high stress gradients nearby the boundaries. The activation and slipping of the slip systems are dependent on the crystallographic orientations of the grains and also on the relative crystallographic orientations of the two adjoining grains. For the tricrystal specimens, there is not always any stress concentrations in the triple junction, and the concentration degree depends on the relative crystallographic orientations of the three grains. Different from the bicrystal specimens, there may be or no stress concentration in the vicinity of grain boundaries for the tricrystal specimens, which depends on the relative crystallographic orientations of the three grains. The stress concentration near to the grain boundaries and triple junction can be high enough for the local plastic deformation, damage and voiding or cracking even when the whole specimen is still under the elastic state. It can be further concluded that homogeneous assumption for polycrystalline materials is not suitable to study the detailed meso- or micro-mechanisms for damaging and fracturing.

Triple Junction Effects in Solids

Line Tension of Grain Boundary Triple Junctions in the Copper Tricrystals

The Line Tension of Grain Boundary Triple Junctions in a Cu-Ni Alloy

Grain Boundary Triple Line Tension in Copper

Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviors of Copper Tricrystal and Tetracrystals

Thermodynamics and Kinetics of Grain Boundary Triple Junctions in Metals: Recent Developments

On the Orientation Dependence of Grain Boundary Triple Line Energy in Cu

Measurement of Grain Boundary Triple Line Energy in Copper

Surface topography and energy of grain boundary triple junctions in copper tricrystals

Energetics and structure of grain boundary triple junctions in graphene

Non-uniform Stress Field and Stress Concentration Induced by Grain Boundary and Triple Junction of Tricrystal

Geometry of triple junctions during grain boundary premelting

On the Stress Distribution Around A Triple Junction

The Effect of Grain Boundary Facet Junctions on Segregation and Embrittlement

Elastic Strain Energy Concentration Along A Triple Junction

Grain boundary effects on the inelastic deformation behavior of bicrystals

Stress-Driven Triple Junction Reconstruction Facilitates Cooperative Grain Boundary Deformation

Finite Element Analysis about Effects of Stiffness Distribution on Stresses and Elastic Strain Energy Near the Triple Junction in a Tricrystal

Restructuring of emergent grain boundaries at free surfaces – an interplay between core stabilization and elastic stress generation

Surface Triple Junctions Govern the Strength of a Nanoscale Solid

A Screw Dislocation Nucleated from A Triple Junction