The Problem of International Acidic Immersion Silver and the New Weak Alkaline Immersion Silver IAG-377 Process

Fang Jingli
DOI: https://doi.org/10.3969/j.issn.1009-0096.2007.05.008
2007-01-01
Abstract:The immersion silver process has become the first choice of final finishing for many OEM,because of its’ shorten process flow,good conductivity,even deposit, good solderability and bonding function, suitable for vertical and horizontal automatic production line. The most popular immersion silver solutions in market contain nitric acid,that will attack copper to cause circuit break and undercut. So immersion time must be only controlled within 1 min, that too short immersion time will cause no silver deposited in the bottom of blind via. The nitric acid based solution systems also use frequently inhibitor or penetrating agent to cause massive void and brittle fracture of solder finally. As the results, the soldering strength will be decreased. CharterSILVER? IAG-377 is a new weak alkaline immersion silver process.It doesn’t contain nitric acid and inhibitor, so that silver deposit possesses high putity, high corrosion resistance, low contact resistance, high soldering strength, high bonding strength and no massive void of solder and no electromigration. CharterSILVER? IAG-377 products fully achieve RoHS and WEEE’s demands, to satisfy the lead-free and other environment requiremenst. Now Charter- SILVER? IAG-377 products have been used in PCB plant of UK , Italy and China.
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