Design of Localized Induction Heating for Microsystem Packaging

CHEN Ming-xiang,LIU Sheng
DOI: https://doi.org/10.3969/j.issn.1673-5692.2011.01.003
2011-01-01
Abstract:Global heating for packaging means heating the substrate,chip and bonding layer to a high temperature,which is a long time process and usually destroy the thermal sensitive devices and micro structures,or results in high thermal stress owing to the mismatch of coefficient of thermal expansion(CTE)between bonding pairs.In this work,localized induction heating for microsystem packaging is presented.Selection of induction power supply,design of inductor and bonding layer,and temperature monitoring are discussed.For localized induction heating and bonding,there exists an optimized frequency range.Induction heating patterns(bonding layer)should be a closed loop and the width should be bigger than the critical size.With different bonding layer materials and structures,the new technology can be applied to microsystem packaging such as solder bonding,eutectic bonding,and diffusion bonding.
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