Mechanical properties of copper-nickel functionally graded materials based on molecular dynamics simulations: material distribution and temperature effects
Yuhan Li,Feixiang Tang,Wenjin Liu,Sheng Liu
DOI: https://doi.org/10.1016/j.vacuum.2024.113889
IF: 4
2024-11-28
Vacuum
Abstract:Functionally graded materials (FGMs) are new materials with great application prospects at present. To meet the requirements of this material in industry, such as excellent strength, hardness, ductility, and ability to work in extreme environments, it is of great significance to study the mechanical behavior of different functionally graded alloys at different temperatures. Furthermore, the growth of materials in a vacuum environment can be involved. In this paper, the functionally graded Cu-Ni alloy has been studied through molecular dynamics (MD). Six models with different content distributions are constructed by the sigmoid function. Their tensile, compressive, and nanoindentation simulations are carried out at 220K, 300K, and 420K. We found that the mechanical properties of Cu-Ni FGMs have a strong dependence on the Ni content. The strength and hardness increase with the increase of Ni content, while the ductility decreases with the increase of Ni content. As the temperature increases, Young's modulus of the material becomes smaller, but it has little effect on the nanoindentation simulation. We also found that the larger lattice constant of Cu leads to the first load value of the pure Cu model in nanoindentation simulation. Our research provides a basis for the design of FGMs and provides a method for exploring materials that can work at different temperatures.
materials science, multidisciplinary,physics, applied