Abstract:The flip-chip technology is widely used in aerospace and defense electronic systems because of its high information processing, rapid response and autonomous control. As flip-chip technology advances towards higher density and finer pitch, the mechanical reliability of chip packaging will decrease, with solder bumps defect being the most common and severe concern. To ensure the safety and availability of electronic systems in industrial production applications, it is very necessary to develop the nondestructive solder bumps detection technology with less manual intervention, lightweight architecture and high detection accuracy. In this study, a self-search lightweight framework (SLF), which integrates architecture feature search (AFS) and logic-space decoupling distillation (LDD), is developed to analyze vibration signals and identify different defects of flip-chip solder bumps. AFS makes up for the three sub-vulnerabilities in existing neural architecture search, which provide a homotypic combination AFS T -AFS S for SLF. LDD decouples the logic space of traditional knowledge distillation into 3-probability spaces, which learn logical feature representations with class boundary discriminability, and facilitates feature migration in the SLF. The vibration noise signal contains a large amount of state information, and the combination with artificial intelligence technology will further support the high precision, efficiency, and reliability of detection. We collected vibration signals of flip-chips through ultrasonic excitation experiments and used them as data input for the proposed method. Specially, the dual-convergence property of AFS and the semantic mapping capability of LDD in SLF have been investigated respectively with the support of this vibration signals. Furthermore, an in-depth investigation of orthogonal analysis and adaptive performance reveals that SLF, which is a combination of AFS and LDD, delivers the best lightweight detection performance compared with other popular methods, which has shown tremendous potential on deploying edge equipment with limited computing power to complete detection in real industrial environments.

Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods.

Quantitative Detection of Surface Defect Using Laser-Generated Rayleigh Wave with Broadband Local Wavenumber Estimation

Detecting features of defect metal based on laser ultrasonic technique

A Novel 3D Evaluation Method for Surface Defects Using Broadband Laser-Generated Rayleigh Waves with Wavenumber Analysis.

INTEGRATED TECHNOLOGY FOR DETECTION AND REPAIR OF MECHANICAL COMPONENT SURFACE FATIGUE MICROCRACKS USING PULSED LASER

Differential Two-Wave Mixing Interferometer for Crack Detection in Metallic Structures Based on Laser-Induced Ultrasound

Flip-chip solder bumps defect detection using a self-search lightweight framework

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Study on Chip Defect Detection Algorithm Based on Ultrasonic Scanning

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Laser ultrasonic testing of defects in milling groove brazed joints of thrust chamber

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Research Status and Progress On Non-Destructive Testing Methods for Defect Inspection of Microelectronic Packaging

Characterization of internal defects in cylindrical components using laser ultrasonic method with a modified SAFT algorithm

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Laser ultrasound wave pattern analysis for efficient defect detection in samples with curved surfaces