New Model for Thermal Contact Conductance Based on Elastic-Plastic Theory

XIONG Ou,CHEN Ji-an,KUANG Bo,WANG Quan-bao,XIE Bao-jin
DOI: https://doi.org/10.3969/j.issn.1006-1630.2010.05.004
2010-01-01
Abstract:A new model was used to predict thermal contact conductance in this paper.In full consideration of the deformation of asperities in contact surface,contact equations of elastic,elastoplastic and plastic deformation of asperities were set up according to the character of continuous deformation of asperities.Weierstrass-Mandelbrot fractal function was used to describe the profile of rough surface because of its fractal feature.A fractal network model for thermal contact resistance was established,taking into consideration of both substrate resistance and surface resistriction resistance.The relation between contact conductance and load was analyzed.The comparison result of this new model with experiment data and model,Mikic elastic model and Yovanovich plastic model showed that this new model could well predict thermal contact conductance,and it was reasonable for this model.
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