Novel Poly(arylene ether nitrile ketone) Copper Clad Laminate

Wang Jinyan,Liu Cheng,Wang Shouli,Wang Qinyi,Jian Xigao
DOI: https://doi.org/10.16790/j.cnki.1009-9239.im.2012.04.003
2012-01-01
Abstract:A copper clad laminate(CCL) of glass cloth reinforced poly(arylene ether nitrile) containing phthalazone(PPENK) was prepared.The effects of PPENK resin content on the flexural strength,peel strength and water absorption and the effects of coupling agent type and content on the flexural strength and peel strength of the CCL were studied.The dielectric properties,soldering resistance and flame retardancy of the CCL were tested.The results show that using KH-560 to treat the glass fiber and KH-550 to treat the copper foil,when the PPENK resin content is 55%,the CCL has optimum comprehensive performances.Under condition of 2 GHz,the dielectric constant and dielectric loss is 3.6 and 0.002 2,respectively.The soldering resistance is over 120 s at 290 ℃,and the peel strength attains 1.6 N/mm.
What problem does this paper attempt to address?