Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive

陶军磊,安兵,蔡雄辉,吴懿平

DOI: https://doi.org/10.3969/j.issn.1001-3474.2010.05.001

2010-01-01

Abstract:Anisotropic conductive adhesive(ACA) has been widely used in RFID chip packaging,and bears the advantages of convenient alignment,low processing temperature,and short processing time.Since ACA interconnection is essentially a mechanical contact,its interconnection reliability severely depends on the nature of the bonding interfaces,the adhesive bonding strength and the environmental stability.The experiments showed that,168 h high temperature and humidity test,and D20 mm mandrel bending test make some impact on the electric contact performance of the bonding point;the yield of the copper module significantly higher than that of the aluminum antenna inlay.