HBr EMISSION CHARACTERISTIC DURING THERMAL TREATMENT OF PRINTED CIRCUIT BOARDS

Wang Xiaoling,Li Haibin,Zhao Zengli
2010-01-01
Environmental engineering
Abstract:The emission characteristic of HBr during thermal treatment of brominated epoxy resin printed circuit boards(PCB) was investigated using TG-FTIR and a quartz-tube reactor.The results indicates that HBr is mainly released from printed circuit boards at the fast weight-losing stage(300~380℃).Heating modes have obvious effects on the yield of HBr.Under non-isothermal heating condition, the final reaction temperatures higher than 380℃ have little effects on the yield of HBr.However,Isothermal heating can improve HBr emission even the final temperature is higher than 380℃.Under temperature lower than 400℃,the partial pressure of oxygen has no effect on the emission of HBr,while at the higher temperature the emission of HBr can be slightly enhanced as the oxygen partial pressure increasing.
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