Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

Fulin Shang,Zikun Wang,Zhonghua Li
DOI: https://doi.org/10.1016/0013-7944(96)00043-4
IF: 5.4
1996-01-01
Engineering Fracture Mechanics
Abstract:Thermopiezoelectric materials have attracted considerable attention because of their potential use in the smart structural systems. Due to the intrinsic coupling effects that take place among thermal, mechanical and electrical fields, the governing equations of a three-dimensional thermopiezoelectric medium are much more complex; relatively few solutions to such coupled problems are available in the literature. In this paper, we propose a method for three-dimensional axisymmetric problems of transversely isotropic thermopiezoelectric materials by means of potential functions and Fourier—Hankel transformations. As an illustrative example, a thermopiezoelectric problem of a penny-shaped crack whose surface is uniformly covered with a constant temperature different from that of the surrounding material is analyzed; the analytical expressions of stress field and electric displacement in the vicinity of the crack are obtained. The results show the characteristic 1√r singular behaviour of the crack-tip stress field and electric displacement.
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