Abstract:2 system at 700°C. The results showed that so long as Cu appears or the electrodeposit process carries on, Cu++ can be reduced into Cu+; that the electrochemical reaction process of copper is a quasi-reversible process mix-controlled by ion copper diffusion rate and electron transport rate; that the electrochemical reaction mechanism is Cu++e-→Cu; that the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; that the Cu ion diffusion coefficient is 2.5×10-4cm2∙s-1 at experimental conditions.

Electrochemical Behavior of Copper in the (Nacl-Kcl-cucl2) Molten Salt